Rigid PCB capacity | |
Material: | FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminum\Metal core\PTFE\Rogers |
Number of Layer: | 1-32Layers |
Out layer Cu thickness: | 1-6OZ |
Inner layer Cu thickness: | 1-4OZ |
Maximum processing area: | 610 x 1100 mm |
Min board Thickness: | 2 Layer - 0.3mm(12mil) |
4 Layer - 0.4mm(16mil) | |
6 Layer - 0.8mm(32mil) | |
8 Layer - 1.0mm(40mil) | |
10 Layer - 1.1mm(44mil) | |
12 Layer - 1.3mm(52mil) | |
14 Layer - 1.5mm(59mil) | |
16 Layer - 1.6mm(63mil) |
Minimum Width: | 0.076mm (3mil) |
Minimum Space: | 0.076mm (3mil) |
Minimum hole size (final hole): | 0.2mm |
Drilling hole size: | 0.2-0.65mm |
Drilling tolerance: | +\-0.05mm(2mil) |
PTH tolerance: | Φ0.2-1.6mm +\-0.075mm (3mil) |
Φ1.6-6.3mm+\-0.1mm(4mil) |
NPTH tolerance: | Φ0.2-1.6mm +\-0.05mm(2mil) |
Φ1.6-6.3mm+\-0.05mm(2mil) |
Finish board tolerance: | Thickness<0.8mm, Tolerance:+/-0.08mm |
0.8mm≤Thickness≤6.5mm,Tolerance+/-10% |
Minimum soldermask bridge: | 0.076mm (3mil) |
Twisting and bending: | ≤0.75% Min0.5% |
Raneg of TG: | 130-215℃ |
Impedance tolerance: | +/-10%,Min+/-5% |
Surface Treatment: | HASL, LF HASL |
Immersion Gold, Flash Gold,Gold finger | |
Immersion Silver, Immersion Tin,OSP |